How to break the deadlock of electronic chip development? The answer is hereIn the field of electronic product testing, due to improper testing procedures, resulting in product recall and rework, will bring unbearable losses. So how to ensure the overall temperature monitoring of products in the laboratory product testing process, timely discovery of product design defects, so as to avoid the huge losses caused by improper testing procedures?  Thermal Imager is a kind of non-contact temperature measuring instrument, through imaging and analyzing the thermal (temperature) distribution on the surface of the object, it can quickly find the thermal defects of the object. Used in electronics industry, can be widely used in the detection of PCB circuit boards, chips, LED, new energy batteries and energy-saving, charging piles and other circuits and equipment, is an essential tool for electrical engineers to do thermal analysis. There are many components on PCB board, if there are short circuit, breakdown, poor welding, etc. . With the help of infrared thermal imagers, researchers can compare the thermal image of a faulty circuit board with that of a normal one, locate components with abnormal temperatures, and test them specifically to significantly improve work efficiency, continuously optimize the performance of PCB circuit board.  Fault analysis of electronic chip When the electronic system failure, the need for appropriate tools to quickly identify the fault or short circuit. High temperature will cause the transistor P-N inside the chip can not be turned on and off normally, leading to chip failure. Non-contact thermal imaging can help you visually detect the chip packaging surface temperature, calculate the approximate internal temperature. It can also wear off the package layer of the chip, and detect the temperature of the wafer, gold wire and connection point directly by Infrared Thermal Imager, so as to speed up the troubleshooting and verification of maintenance.  Fine overhaul of small components With the continuous reduction of component volume, the heating problem is increasing rapidly. From a VXI circuit board with a size of about 9”× 13” to a single component of a smartphone with a size of only a few hundred microns, infrared thermal imagers can be used to directly measure the micro-temperature of the unpackaged microchips at the micrometer level, accurately finding the overheated connection wires and points, and improving the chip design. Ordinary thermal imagers may be difficult to distinguish its small temperature difference, FLIR Axxx Series Thermal Imager Development Kit has dedicated to this part of the Professional Thermal Imager. |
